Electroless nickel immersion gold, also known as immersion gold (Au). Electroless nickel immersion gold plating consists of a layer of gold over a layer of nickel. The top layer protects the bottom layer from oxidation, ensuring stability.
The chemical Ni/Au is a metal process used in plating primarily Printed Circuit Boards (PCBs). Also improve solderability of copper contacts and plated through-holes application.
